questions? contact us: marketing@amkor.com visit amkor technology online for locations and to view the most current product information. saw mlf pel (plated end lead) package customer demand for fine lead pitch (0.50 mm, 0.65 mm) is needed in the automotive industry. higher solder fillet height on the side of lead area; similar or better blr performance than standard design; no need of x-ray monitoring after smd. this process is released to hvm (high volume manufacturing). fam (film assist mold) mlf package better release-ability which enables complicated mold structures like cavity- open packages (seal film); protection on brittle surface of die and glass lids from mechanical impact by cavity insert on mold chase (seal film); resin/mold flash control (adhesive film). pqfn (power) mlf package to qualify fet (field effect transistor) devices in qfn package using solder paste and copper clip; layout and packaging use copper connections for all power paths rather than wire bonds, reducing losses due to high resistance wire bonds as well as high inductance which cause ringing and high ac losses. rtmlf (routable molded lead frame) package an mlf? package with resin filled traces for small form factor driven structures. this offers a low cost, high thermal performance device in a smaller foot print. it has internal routing traces with limited line width/space capability and this package adapts easily to flipchip configurations. rtmlf provides higher pin count and more flexible internal trace routing with resin filled lf. it enable small form factor, high electrical/thermal performance with low cost. ds572q rev date: 10/15 micro leadframe ? mlf ? /qfn/SON/dfn microleadframe ? quad flat no-lead package (mlf ? /qfn/SON/dfn) amkor's micro leadframe ? qfn package is a near csp plastic encapsulated package with a copper leadframe substrate. this package uses perimeter lands on the bottom of the package to provide electrical contact to the pwb. the package also offers amkor's exposedpad technology as a thermal enhancement. having the die attach paddle exposed on the bottom of the package surface provides an efficient heat path when soldered directly to the pwb. this enhancement also enables stable ground by use of down bonds or by electrical connection through a conductive die attach material. mlf offerings ? chip-on-lead (col) ? single row (up to 108 i/o) ? dual row (up to 180 i/o) ? multi chip package ? non-exposed pad ? ppf (nipd) punch & saw mlf ? small mlf (less than 2 x 2 body size) ? stacked die ? thin micro leadframe ? ? top exposed pad (tep) ? inframe cavity mlf ? flipchip mlf dual row mlf package an mlf package with two rows of leads offers a cost effective, high performance solution for devices requiring up to 180 i/o. typical applications include hard disk drives, usb controllers and wireless lan. leadframe data sheet
questions? contact us: marketing@amkor.com visit amkor technology online for locations and to view the most current product information. thermal performance multi-layer pcb pkg body size (mm) # board vias exposed pad (mm) die (mm) ja (c/w) 12 ld 3 x 3 1 1.25 1.25 61.1 28 ld 5 x 5 9 2.7 2.54 34.8 44 ld 7 x 7 16 4.8 3.81 24.4 52 ld 8 x 8 25 6.1 5.08 20.9 64 ld 10 x 10 36 7.1 2.79 29.4 124 ld 10 x 10 36 7.1 2.79 30.0 jedec standard test boards modeled data @ 0 air flow electrical performance pkg body size (mm) lead inductance (nh) capacitance (pf) resistance (m) 12 ld 3 x 3 longest shortest 0.564 0.531 0.203 0.220 141.8 138.9 44 ld 7 x 7 longest shortest 1.766 1.194 0.326 0.289 315.1 234.5 64 ld 10 x 10 longest shortest 2.179 1.475 0.518 0.409 337.5 250.8 simulated results @ 2 ghz values dependent on specific die and wire configurations reliability qualification amkor devices are assembled in optimized package designs with proven reliable semiconductor materials. ? moisture sensitivity jedec level 1*, 85 c/85% rh, 168 hrs characterization ? uhast 130 c/85% rh, 96 hrs ? temp/humidity 85 c/85% rh, 1000 hours ? temp cycle -65 c/+150 c, 1000 cycles ? high temp storage 150 c, 1000 hours *depending on body size process highlights ? die thickness .20 .05 mm nominal, thinner for special applications ? plating matte sn, nipdauag ? marking laser standard materials ? leadframe copper alloy, dual gauge ? die attach conductive epoxy, non-conductive epoxy or daf ? wire 0.8 mil au, 1% pd doped, 0.8 mil cu 0.8 mil ag ? mold compound pb-free/green capable test services ? program generation/conversion ? product engineering ? available test/handling technology ? burn-in capabilities ? tape and reel services shipping ? clear anti-static tubes, bakeable trays or metal canisters micro leadframe ? mlf ? /qfn/SON/dfn applications the small size and weight along with excellent thermal and electrical performance make the micro leadframe package an ideal choice for handheld portable applications such as cell phones and pdas or any other application where size, weight and package performance are required. features ? small size (reduce package footprint by 50% or more and improved rf performance) and weight ? standard leadframe process flow and equipment ? 0.4 mm to 2.03 mm maximum height ? 4 to 180 i/o ? 1-13 mm body size ? thin profile and superior die-to-body size ratio ? pb-free/green ? flexible designs for optimal electrical and thermal performance ? saw and punch versions available ds572q rev date: 10/15 leadframe data sheet
questions? contact us: marketing@amkor.com visit amkor technology online for locations and to view the most current product information. ds572q rev date: 10/15 configuration options mlf package family (mm) body size (mm) qfn/SON/dfn lead counts 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 mm pitch dual row lead counts 0.5 mm pitch saw punch ? 1 x 1 C 4/ 6 C ? 2 x 2 C 6/8/10/12 C ? 3 x 3 ? 4/8/10/12/16/20/24 C ? 4 x 4 ? 12/16/20/24/28/32/40 C ? 5 x 5 ? 16/20/28/32/36/40/44/52 44/52 ? 6 x 5 ? 18/24/36/42 C ? 6 x 6 ? 20/24/28/36/40/48/56/64 60/68 ? 7 x 7 ? 28/32/36/44/48/56/68/80 76/84 ? 8 x 8 ? 32/36/40/52/56/68/76/88 92/100 ? 9 x 9 ? 36/44/48/60/64/76/88/104 108/116 ? 10 x 10 ? 44/52/56/68/72/88/100/116 124/132 C 11 x 11 ? C 140/148 C 12 x 12 ? 48/60/84/88/100/108/124/144 156/164 C 13 x 13 ? C 164/180 note: various package sizes available between (1 x 1) through (3 x 3), i.e., (2.5 x 2.5), (2 x 1), (1.5 x 1.5) save valuable board space with mlf ? packages! package height compariSON micro leadframe ? mlf ? /qfn/SON/dfn cross-sections mlf individual unit design "punch" map design "saw" leadframe data sheet with respect to the information in this document, amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. this document does not in any way extend or modify amkors warranty on any product beyond that set forth in its standard terms and conditions of sale. amkor reserves the right to make changes in its product and specifications at any time and without notice. the amkor name and logo are registered trademarks of amkor technology, inc. all other trademarks mentioned are property of their respective companies. ? 2015, amkor technology incorporated. all rights reserved.
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